Micro perforation technology
Laser perforation in general, possible to perforate by pulsed or enlarged and focused laser beams are holes sizes from 60 to 200 microns at density of holes, holes sequences from 100,000 to 400,000 holes per second at a maximal of 16 punctured rows by laser distributed over the material web width with traditional systems or machines. Means in cigarette, tipping, plug wrap, filter, packaging, packs, tear tape, plastic and other material webs. With porosity level, normally in web width at web speed, depending on porosity and material consistency in relation to its ability to perforate. 
 
Other industry fields
The conception of high power twin level laser beam multiplexer enables hundred options in other industry application fields as cutting, cut off, welding, surface finishing, drilling, ablation, cleaning, micro machining, polishing, forming, melting, surface treatment, roughness improvement. Each of 200 single laser beams and coupled flexible hollow fibers allow treatment processes or perforation heads easy to position in X across and in Y direction of running web or static placed sheet material. 

The automatic processes, equipments and devices open now outstanding possibilities in industry, metal, plastic, domestic, tobacco product, medical, hygienic, wall covering, security cards, bank notes or food application. LPM-1 means cluster material treatment at wide web, large area, surface or whole material treatment, high power dual rotation laser beam splitter, twin multiplexer level, CO2, YAG, EXCIMER, DIODE, SOLID STATE laser with multiple optical inputs, flexible hollow fiber and up to 200 output channels. 

Material treatment and robotic handling for stainless steel, ceramic, aluminum, wafer, glass, brass, copper, wafer, silicon, plastic sheets, titanium, jewelry, silicon, solar, panel, photovoltaic, micro machining, slitting, rewinding, refining, hybrid laser cutting machines or stand along systems.